● 高端国产化替代
● 特种硅片供应商
● logic, Flash，CIS，Power Driver,BCD，MCU
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- 硅片
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大直径硅材料1
1
产品描述
参数
| Type | Wafer Description | Key Specification | Application |
| Prime | S2 polished wafer | Resistivity: 8-12 ohmcm 11.5-15.5 ohmcm LPDN:<10ea@0.12um |
logic./Flash/CIS etc |
| Prime | Polished wafer | Resistivity:8-12 ohmcm 11.5-15.5 ohmcm |
logic./Flash/CIS etc |
| Prime | Argon anneal wafer | Resistivity: 15-25 ohmcm 11.5-15.5 ohmcm/8-12 ohmcm |
Driver |
| Prime | High Rs Polished wafer | Resistivity:80-100 ohmcm 200-400ohmcm |
BCD |
| Prime | GaN Sub | P Type (111) Thickness:1150 um |
GaN Power |
| Prime | OX wafer | Resistivity: 1-100 ohmcm OX 5000-10000a customized |
other |
| Test | Super Flat | Resistivity: 0.5-100 ohmcm SFQR<0.3 um |
Monitor |
| Test | Test/Dummy | Resistivity: 0.5-100 ohmcm | Test |
| Reclaim | Wafer Reclaimed | P/N Metal/Non-Metal |
Test |
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